Radiation curable compositions and their use

Details Radiation curable compositions and their use Radiation curable compositions and their use

C - Chemistry, Metallurgy

08

G

C08G 63/54 (2006.01) C08G 63/676 (2006.01) C08L 29/02 (2006.01) C08L 29/10 (2006.01) C08L 67/06 (2006.01) C09D 5/34 (2006.01) C09D 167/06 (2006.01)

Patent

CA 2103540

The present invention relates to compositions which may be cured by radical polymerization at room temperature and contain A) 20 to 100 parts by weight of .alpha.,.beta.-ethylenically unsaturated polyesters which are the reaction products of a) a dicarboxylic acid component containing i) 40 to 100 carboxyl equivalent % of .alpha.,.beta. ethylenically unsaturated dicarboxylic acids and/or their anhydrides and ii) 0 to 60 carboxyl equivalent % of dicarboxylic acids and/or their anhydrides other than those set forth in i) with b) an alcohol component containing i) 25 to 100 hydroxyl equivalent % of alkoxylated 2-butene-1,4-diols having an average molecular weight 130 to 400 and ii) 0 to 75 hydroxyl equivalent % of mono- or poly- hydric alcohols having a molecular weight of 32 to 400 other than those set forth in i) wherein the amounts of a) and b) are chosen such that the equivalent ratio of carboxyl groups to hydroxyl groups is no more than 1:1, B) 0 to 80 parts by weight of compounds containing (meth)acryloyl groups and/or vinyl ether groups, wherein the sum of the parts by weight of A) and B) is 100, based on the weight of components A) and B), provided that when components A) and B) are used in a weight ratio exceeding 9:1, component a) contains at least 90 carboxyl equivalent % of component ai) and component b) contains at least 40 hydroxyl equivalent % component bi). The present invention also relates to the use of these compositions as binders for coating, patching or sealing compositions and for the production of molded bodies.

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