C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
C08F 220/06 (2006.01) B05D 3/06 (2006.01) C08L 33/02 (2006.01) C09D 4/00 (2006.01) C09D 4/06 (2006.01) C09D 133/02 (2006.01)
Patent
CA 2118104
ABSTRACT Radiation curable compositions having Improved substrate adhesion, cured compositions, a method of adhering a radiation cured composition to a substrate, a method for providing a substrate with an adherent radiation cured coating or film, and substrates with coatings or films formed from a radiation curable composition are provided, wherein the composition comprises at least one radiation curable compound. a metal salt of an .alpha.,.beta.-ethylenically unsaturated carboxylic acid and, optionally, a photoinitiator and/or a solvent.
Cauffman Timothy E.
Ceska Gary W.
Hazell Thomas W.
Sartomer Company Inc.
Swabey Ogilvy Renault
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