Radiation curable hot melt pressure sensitive adhesives

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

C09J 133/00 (2006.01) C08F 299/00 (2006.01) C08G 18/62 (2006.01) C08G 18/81 (2006.01) C08J 3/28 (2006.01) C09J 5/06 (2006.01) C09J 7/02 (2006.01)

Patent

CA 2114466

This invention is a hot melt pressure sensitive adhesive formed by copolymerizing acrylic, or a combination of acrylic and vinyl, monomers with the functional monomer, 1-(1-isocyanato-1-methyl ethyl)-3-(1-methyl ethenyl)benzene m-TMI, to give a saturated polymer with pendant vinyl groups that are crosslinked by UV or EB radiation.

La présente invention concerne un adhésif thermofusible sensible à la pression formé par copolymérisation d'acrylique, ou d'une combinaison d'acrylique et de vinyle, avec des monomères porteurs du monomère fonctionnel, 1-(1-isocyanato-1-méthyléthyl)-3-(1-méthyléthényl)benzène m-TMI, pour donner un polymère saturé portant des groupes vinyle pendants qui sont réticulés par les rayonnements UV ou par faisceau électronique.

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