C - Chemistry – Metallurgy – 04 – B
Patent
C - Chemistry, Metallurgy
04
B
400/4909, 400/50
C04B 38/08 (2006.01) G03F 7/027 (2006.01)
Patent
CA 1272541
ABSTRACT OF THE DISCLOSURE A radiation curable liquid resin composition comprising a radiation curable liquid base resin and polymer microparticles having an average particle size from 0.01 to 6 microns. The incorporation of polymer microparticles to the base resin may improve the rheological property of the liquid composition and also the physical properties of cured film therefrom.
499175
Kanda Kazunori
Mizuguchi Ryuzo
Nippon Paint Co. Ltd.
Ridout & Maybee Llp
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