Radiation curable pressure sensitive adhesive composition

Details Radiation curable pressure sensitive adhesive composition Radiation curable pressure sensitive adhesive composition

C - Chemistry, Metallurgy

08

L

400/3023, 400/51

C08L 33/14 (2006.01) C08L 71/02 (2006.01) C09J 4/06 (2006.01)

Patent

CA 1107428

11, 294 RADIATION CURABLE PRESSURE SENSITIVE ADHESIVE COMPOSITION ABSTRACT OF THE INVENTION Radiation curable pressure sensitive adhesive composition comprises: a polyoxyalkylene homo- or copolymer which is either a polyoxyethylene homopolymer or a poly (oxyethylene - oxypropylene) copolymer, or mixture thereof, having a molecular weight of from 1,700 to 90,000, in which at least 40 percent by weight of the oxyalkylene units are oxyethylene units; a liquid carbamyloxy alkyl acrylate; and, optionally, a photo- initiator. S P E C I F I C A T I O N

318759

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