Radiation curable resin composition

Details Radiation curable resin composition Radiation curable resin composition

C - Chemistry, Metallurgy

08

F

400/4024, 400/51

C08F 290/14 (2006.01) C08F 290/06 (2006.01)

Patent

CA 1109580

ABSTRACT OF THE DISCLOSURE A resin composition is disclosed comprising, as essential ingredients, (I) a urethanized epoxy resin or a urethanized epoxy resin acrylate or methacrylate, (II) a ketone resin and (III) a cross-linkable or polymerizable compound containing at least two ethylenically unsaturated groups.

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