Radiation-sensitive compositions

Details Radiation-sensitive compositions Radiation-sensitive compositions

G - Physics

03

F

G03F 7/029 (2006.01) C08G 63/181 (2006.01) C08G 63/199 (2006.01) C08G 63/547 (2006.01) C08G 63/688 (2006.01) C08K 5/375 (2006.01) G03F 7/039 (2006.01)

Patent

CA 2083623

EM/K-18862/A Radiation-sensitive compositions Abstract of the Disclosure Radiation-sensitive compositions comprising (a) a polyester containing structural repeating units of formula (I) Image (I), wherein Z is a radical of formulae (IIa)-(IIh) Image (IIa), Image (IIb), Image (IIc), Image (IId), Image (IIe), Image (IIf), Image (IIg), Image (IIh), wherein Y is a direct bond, C1-C20 alkylene, phenylene, -CH2-C6H4-CH2-, cyclopentylene or cyclohexylene, and R1 and R2 are each independently of the other hydrogen, methyl or ethyl, with the proviso that R1 and R2 are not simultaneously hydrogen, and (b) a substance that generates acid upon exposure to actinic radiation, form a highly sensitive high resolution positive photoresist formulation which is suitable for DUV lithography and, in particular, for making integrated circuits.

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