Radiation sensitive mixture and production of relief patterns

Details Radiation sensitive mixture and production of relief patterns Radiation sensitive mixture and production of relief patterns

G - Physics

03

F

96/175

G03F 7/004 (2006.01)

Patent

CA 1334898

A radiation sensitive mixture useful for producing relief patterns contains (a) a polymeric binder which is insoluble in water but soluble in aqueous alkaline solutions and (b) an organic compound whose solubility in an aqueous alkaline developer is increased by the action of acid and which contains at least one acid cleavable group and additionally a group which forms a strong acid on irradiation, and in addition (c) a nonphotosensitive organic compound which contains at least one acid cleavable bond and the solubility of which in an aqueous alkaline developer is in- creased by the action of acid, or (d) a nonphotosensitive organic compound which contains at least one acid cleavable bond and which by the action of acid decomposes in such a way as to be completely removable by treatment at from 60 to 120°C

597191

Affiliated with

Also associated with

Rating

Radiation sensitive mixture and production of relief patterns does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Radiation sensitive mixture and production of relief patterns, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Radiation sensitive mixture and production of relief patterns will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1308046