Radiator assembly for substrate

H - Electricity – 01 – L

Patent

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Details

H01L 23/40 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2096983

A radiator (3) is coupled by caulked joints with fitting plates (5, 15) fixed to the substrate (8) by soldering. By heat-conductively attaching the fitting plate (5, 15) to both sides of the radiator (3), apertures (7) for receiving a prying tool (6) are formed between the radiator (3) and the fitting plate (5, 15). The fitting plate (5, 15) is pried open by the typical tool, thereby the radiator (3) is easily separated from the substrate (8) in order to be used as recycling resources.

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