C - Chemistry – Metallurgy – 09 – K
Patent
C - Chemistry, Metallurgy
09
K
402/261
C09K 3/10 (2006.01) C08G 59/18 (2006.01) C08J 3/24 (2006.01) C09J 7/00 (2006.01)
Patent
CA 1229696
ABSTRACT OF THE DISCLOSURE A putty-like epoxy adhesive sealant composition comprised of a first band of an uncured epoxy resin composition and a second band comprising a composition capable of rapidly curing the uncured epoxy resin composition within about ten minutes from the time when said first band and said second band are combined to form a substantially uniform mixture. The second band comprises an inner core of a fast curing agent enveloped by an outer surrounding wrap of a curing agent composition capable of protecting said fast curing agent from premature reaction with said uncured epoxy resin, and from reaction with the atmosphere where the curing agent becomes oxidized and prematurely hard. Substantially equal amounts of said first band and said second band are combined to form a substantially uniform mixture which cures to form a cured epoxy adhesive sealant within about ten minutes.
398831
Flint Theodore R.
Ridout & Maybee Llp
LandOfFree
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