Rapid-curing adhesive formulation for semiconductor devices

Details Rapid-curing adhesive formulation for semiconductor devices Rapid-curing adhesive formulation for semiconductor devices

H - Electricity

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H01L 23/12 (2006.01) H01L 21/58 (2006.01) H01L 23/14 (2006.01) H01L 23/373 (2006.01) H01L 23/482 (2006.01)

Patent

CA 2094292

2094292 9208247 PCTABS00013 A rapid curing adhesive formulation that contains 10-40 wt. % of a cyanate ester vehicle having a cyanate ester, alkylphenol and a metal curing catalyst and 60-90 wt. % of thermally and/or electrically conductive filler. The adhesive formulation has a maximum curing time of 5 minutes, preferably 2 minutes, at 200 ·C and is adapted for use in high speed processes for production of bonded semiconductor assemblies.

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