H - Electricity – 01 – B
Patent
H - Electricity
01
B
400/5805
H01B 1/06 (2006.01) C08G 59/62 (2006.01) C08L 79/08 (2006.01) C09J 4/06 (2006.01) C09J 163/00 (2006.01) H01L 21/58 (2006.01)
Patent
CA 1286818
RAPID CURING, THERMALLY STABLE ADHESIVE ABSTRACT A novel adhesive exhibiting low outgassing upon exposure to high temperatures is disclosed. The instant adhesive comprises: (a) an epoxy resin, (b) a soluble polyimide resin, (c) a reactive solvent; and (d) an alkenylphenol crosslinker which preferably contains polyhydroxy and polyalkenyl substituents. Optionally, the adhesive may also contain a conductive material.
529886
Disalvo Anthony L.
Goswami Jagadish C.
Rehder Richard A.
Ablestik Laboratories
Disalvo Anthony L.
Goswami Jagadish C.
Gowling Lafleur Henderson Llp
National Starch And Chemical Corporation
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