C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4014, 400/59
C08L 33/12 (2006.01) A61K 6/00 (2006.01) C08L 63/10 (2006.01) C09J 4/00 (2006.01)
Patent
CA 1044838
TITLE OF THE INVENTION: RAPID SETTING HIGH BOND STRENGTH ADHESIVE ABSTRACT OF THE DISCLOSURE: Disclosed is a rapid setting adhesive of low toxicity having high bond strength to a variety of metals and plastics, and particularly to stainless steel, polycarbonate plastics and tooth enamel. The composition consists essentially of (A) a resin which is formed from an ester of methacrylic acid with a monoalcohol containing at least one epoxy group and (B) a filler which may be any of a plurality of finely divided materials that are insoluble in ambient fluids or a mixture of such fillers, parts (A) and (B) being present in a weight ratio such that the initial mixture at ambient temperature and pressure is a viscous liquid or paste. Also included are minor amounts of a conventional polymerization catalyst and a conventional polymerization accelerator. Preferably parts (A) and (B) are packaged separately, with polymerization catalyst included in only one package. In one embodiment of the invention, to insure thermostability at elevated temperatures, about 10 to about 80 parts by weight, per 100 parts of (A) plus (B), of an aliphatic or aromatic dimethacrylate is added as a cross-linking agent. In a preferred embodiment (A) is glycidyl methacrylate. Many variations are possible within the scope of the invention depending upon the viscosity, set time and mechani- cal bond strength desired for a particular end use.
205589
Lee Henry L. (jr.)
Orlowski Jan A.
Lee Pharmaceuticals
Na
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