Reactive adhesive with a low monomer content and with...

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

C09J 175/16 (2006.01) C08F 283/00 (2006.01) C08F 290/06 (2006.01) C08G 18/12 (2006.01) C08G 18/67 (2006.01) C08G 18/81 (2006.01)

Patent

CA 2426554

The invention relates to a solvent-free reactive adhesive or a reactive adhesive containing solvents, which has a low monomer content and which hardens in multiple stages. The reactive adhesive contains at least one polyurethane prepolymer (A) with a low monomeric polyisocyanate content (a) and at least one free functional group which is capable of reaction with a compound having at least one acid hydrogen atom, especially at least one isocyanate group; and at least one compound (B) with at least one radiation- polymerisable functional group. The reactive adhesive is suitable for producing composite materials and has a high degree of flexibility as well as good initial adhesion.

L'invention concerne un adhésif réactif pauvre en monomères contenant un diluant ou en étant exempt, durcissant en plusieurs étapes et comportant au moins un prépolymère polyuréthanne (A) à faible teneur en polyisocyanate (a) monomère et au moins un groupe fonctionnel libre, apte à réagir avec une liaison contenant au moins un atome d'hydrogène acide, notamment au moins un groupe isocyanate. Cet adhésif contient également au moins une liaison (B) comportant au moins un groupe fonctionnel polymérisable par rayonnement. Cet adhésif réactif sert à la fabrication de matériau multicouche et présente une haute flexibilité ainsi qu'une bonne adhérence de départ.

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