Reactive hot-melt adhesive

Details Reactive hot-melt adhesive Reactive hot-melt adhesive

C - Chemistry, Metallurgy

08

L

400/4703, 400/59

C08L 63/00 (2006.01) C08G 59/10 (2006.01) C08G 59/22 (2006.01) C08G 59/40 (2006.01) C09J 163/00 (2006.01)

Patent

CA 1341122

A reactive hot-melt adhesive is described, which contains a resin component, at least one thermally activatable latent curing agent for the resin component and optionally accelerators, fillers, thixotropic agents and further conventional additives. The adhesive is characterized in that the resin component is obtainable by reacting a) an epoxy resin solid at room temperature and b) an epoxy resin liquid at room temperature with c) a linear polyoxypropylene having amino terminal groups, in which the epoxy resins a) and b) are used in such a quantity, based on the polyoxypropylene with amino terminal groups, that an excess of epoxy groups, based on the amino groups, is ensured.

607945

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