Reactive hot-melt adhesive

Details Reactive hot-melt adhesive Reactive hot-melt adhesive

C - Chemistry, Metallurgy

09

J

C09J 163/00 (2006.01) B32B 15/08 (2006.01) C08G 59/10 (2006.01) C08G 59/22 (2006.01) C08G 59/50 (2006.01) C09J 163/02 (2006.01)

Patent

CA 2112410

A reactive hot melt adhesive contains, as resin component, a reaction product of a) 0.5 to 1 equivalents of an epoxy resin, which is solid at room temperature, which has an epoxide equivalent weight of 400 to 700 and which is prepared from bisphenol A and/or bisphenol F and epichlorohydrin, b) 0.5 to 1 equivalents of an epoxy resin, which is liquid at room temperature, which has an epoxide equivalent weight of 150 to 200 and which is prepared from bisphenol A and/or bisphenol F and epichlorohydrin and c) 0.125 to 0.5 equivalents of amino-terminated polyethylene and/or polypropylene glycols.

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