C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 175/08 (2006.01) C08G 18/12 (2006.01) C08G 18/40 (2006.01) C08K 7/26 (2006.01) C09J 5/06 (2006.01) C09J 11/04 (2006.01) C09J 11/06 (2006.01) C09J 175/04 (2006.01)
Patent
CA 2195645
A reactive hot melt adhesive and/or sealing composition having a heat of crystallization in joules/gram of -2 or lower, comprising a curable heat-flowable adhesive material and a particulate filler, wherein said composition has a thermal conductivity of less than 0.30 W/m.cndot.°C. The invention also relates to a method of using the adhesive/sealer composition described herein to fill a cavity or recess in a substrate and the filled substrates formed thereby.
L'invention concerne une composition de colle thermofusible réactive et/ou de scellement présentant une chaleur de cristallisation en joules/gramme égale ou inférieure à -2, comprenant un matériau adhésif thermocoulant durcissable et une charge particulaire. Ladite composition présente une conductibilité thermique inférieure à 0,30 W/m<.> DEG C. L'invention concerne également un procédé d'utilisation de cette composition de colle/pâte de scellement pour remplir une cavité ou un évidement dans un substrat, et les substrats remplis ainsi formés.
Minnesota Mining And Manufacturing Company
Smart & Biggar
LandOfFree
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