Rear subframe attachment mount for hydroformed frame

B - Operations – Transporting – 62 – D

Patent

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Details

B62D 23/00 (2006.01)

Patent

CA 2570000

An attachment mount apparatus connects a subframe component to the lower frame midrail structure for an automotive vehicle that is formed from a pair of tubular members manufactured through a hydroforming process. The two tubular members are formed with a pair of opposing semi-cylindrical depressions to receive a cylindrical mounting member internally of the frame structure. One of the semi-cylindrical depressions and the corresponding outer wall of the tubular member are pierced to receive the cylindrical mount and a mounting plate. The opposing semi-cylindrical depression serves as a stop to locate the cylindrical mount along the centerline of the frame structure. The mounting plate spans the entire frame structure and is supported on four wall thicknesses to provide a stable mount structure for subframe components. The cylindrical mounting member is threaded to receive a fastener for the mounting of the subframe member.

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