Reducing polymerization stress by controlled segmental curing

Details Reducing polymerization stress by controlled segmental curing Reducing polymerization stress by controlled segmental curing

A - Human Necessities

61

C

A61C 19/00 (2006.01) A61C 13/15 (2006.01) B29C 35/08 (2006.01) G02B 6/04 (2006.01) G02B 6/42 (2006.01)

Patent

CA 2403154

A photopolymerizable material is exposed to light to effect curing. A portion of the material is exposed to light in a conventional manner, while at least one other portion of the material is masked from direct exposure to the light by use of a mask (10) having at least one mask segment (11) which either completely or at least partially blocks the light. In this manner, the polymerization stress associated with the cured materials is limited or minimized due to extended molecular relaxation promoted by this controlled or hybrid curing technique. Also according to the invention, different segments (30, 31) of a material to be cured (22) are exposed to different wavelengths of light energy (21) or one such segment (30, 31) is exposed to light energy while another such segment is not.

La présente invention concerne un matériau photopolymérisable exposé à la lumière en vue de sa cuisson. Une partie du matériau est exposée à la lumière par procédé classique, alors qu'au moins une autre partie du matériau est masquée, pour ne pas subir d'expositions directe à la lumière, à l'aide d'un masque (10) présentant au moins un segment de masque (11) qui soit bloque la lumière complètement, soit la bloque au moins partiellement. Par conséquent, on réduit ou on limite la contrainte de la polymérisation associée aux matériaux cuits en raison de la relaxation moléculaire accrue favorisée par cette technique de cuisson contrôlée ou hybride. En outre, différents segments (30, 31) de matériau à cuire (22) sont exposés à diverses longueurs d'ondes d'énergie lumineuse (21), ou alors seulement un des segments (30, 31) est exposé à une énergie lumineuse alors que l'autre en est dispensé.

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