C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
252/41, 252/42
C09J 5/02 (2006.01) C08J 3/24 (2006.01) H05K 3/30 (2006.01) H05K 3/38 (2006.01)
Patent
CA 2276737
In accordance with the present invention, adhesive formulations have been developed which enable curing of adhesively bonded assemblies (i.e., assemblies which comprise devices which have been adhesively bonded to substrates) with dramatically reduced occurrence of void formation upon curing. In many instances, void formation can be eliminated employing invention compositions. In accordance with another aspect of the present invention, methods employing the above-described adhesive formulations are also provided, as are substantially void-free articles produced thereby.
L'invention porte sur des formules d'adhésifs permettant le durcissement d'ensembles liés par des adhésifs (par exemple d'ensembles comportant des dispositifs ayant été collés à des substrats) en réduisant considérablement les vides se produisant pendant le durcissement. Dans de nombreux cas, la formation des vides peut être éliminée lorsqu'on utilise les compositions de l'invention. L'invention porte également sur des procédés d'utilisation des formules susmentionnées et sur des articles sensiblement exempts de vides ainsi produits.
Gowling Lafleur Henderson Llp
Quantum Materials Inc.
LandOfFree
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