Reduction of dermal scarring

Details Reduction of dermal scarring Reduction of dermal scarring

C - Chemistry, Metallurgy

07

H

C07H 21/04 (2006.01) A61K 48/00 (2006.01) C12N 15/00 (2006.01) C12N 15/09 (2006.01) C12N 15/63 (2006.01) C12N 15/85 (2006.01) C12N 15/86 (2006.01)

Patent

CA 2546287

Methods and compositions for reducing or inhibiting dermal scarring by expressing p21WAF1/Cip1 in a wound site are provided.

La présente invention a trait à des procédés et des composition pour la réduction ou l'inhibition de la cicatrisation dermique par l'expression de? ¿p21?WAF1/Cip1¿ dans un site de plaie.

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