Reduction of heat loss in micro-fluid ejection devices

B - Operations – Transporting – 41 – J

Patent

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B41J 2/05 (2006.01)

Patent

CA 2630028

The present disclosure is directed to a micro-fluid ejection head for a microfluid ejection device. The head includes a semiconductor substrate, a fluid ejection actuator supported by the semiconductor substrate, a nozzle member containing nozzle holes attached to the substrate for expelling droplets of fluid from one or more nozzle holes in the nozzle member upon activation of the ejection actuator. The substrate further includes a thermal insulating barrier layer between the semiconductor substrate and the fluid ejection actuator. The thermal insulating barrier layer includes a porous, substantially impermeable material having a thermal conductivity of less than about 1 W/m-K.

L'invention concerne une tête d'éjection microfluidique destinée à un dispositif d'éjection microfluidique. Ladite tête comprend un substrat semi-conducteur, un actionneur d'éjection fluidique supporté par le substrat semi-conducteur, un élément de buse présentant des trous de buse fixé au substrat afin d'expulser les gouttelettes de fluide provenant d'un ou de plusieurs trou(s) dans l'élément de buse lors de l'activation de l'actionneur d'éjection. Le substrat comprend également une couche barrière d'isolation thermique disposée entre le substrat semi-conducteur et l'actionneur d'éjection fluidique. La couche barrière d'isolation thermique comprend un matériau poreux sensiblement imperméable à conductivité thermique inférieure à environ 1 W/m-K.

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