C - Chemistry – Metallurgy – 22 – C
Patent
C - Chemistry, Metallurgy
22
C
C22C 27/02 (2006.01) C22C 27/00 (2006.01) C22F 1/02 (2006.01) C22F 1/16 (2006.01) C22F 1/18 (2006.01) C23C 14/34 (2006.01)
Patent
CA 2438819
A method (10) of forming sputtering target from ingots of tantalum or niobium of requisite purity by the process of cutting the ingot to short lengths (12) and pressure working (14, 22, 30, 34) the ingot along alternating essentially orthogonal work axes. Intermediate anneals (18, 26, 38) are applied as necessary to establish a uniform texture thickness-wise and area-wide throughout the target, including the center. The uniform texture is a substantially constant mix of grains with orientation (100) and (111), thereby improving sputtering performance by providing a more predictable sputter rate to control film thickness.
L'invention concerne un procédé (10) destiné à la formation de cibles de pulvérisation cathodique à partir de lingots de tantale ou de niobium d'une certaine pureté, utilisant une technique consistant à découper le lingot en petites longueurs (12) et à ouvrer par pressage (14, 22, 30, 44) le lingot le long d'axes de travail alternés, globalement orthogonaux. Des étapes intermédiaires de recuit (18, 26, 38) sont appliquées en fonction des besoins pour obtenir une texture uniforme en termes d'épaisseur et de surface de la cible, y compris pour le centre. Cette texture uniforme est constituée principalement par un mélange constant de grains à orientation (100) et (111) permettant d'améliorer les performances de la pulvérisation cathodique grâce à un taux de recuit plus prévisible et ainsi de contrôler l'épaisseur du film.
Jepson Peter R.
Kumar Prabhat
Uhlenhut Henning
H.c. Starck Inc.
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
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