Reinforced solder joints for printed circuit boards

Details Reinforced solder joints for printed circuit boards Reinforced solder joints for printed circuit boards

H - Electricity

05

K

H05K 1/18 (2006.01) B23K 1/008 (2006.01) H05K 3/34 (2006.01) H05K 3/40 (2006.01)

Patent

CA 2254676

There is disclosed herein a printed circuit board 50 having reinforced solder joints, comprising: a substrate 11 having mounting pads 14 arranged thereon; a surface mount component 13 having terminations 12, wherein the component 13 is disposed on the substrate 11 with each termination 12 being registered atop a respective mounting pad 14; a solder joint 10 connecting each termination 12 with its respective mounting pad 14; and a thin metallic member 30 disposed within each solder joint 10 between each termination 12 and its respective mounting pad 14. A method for producing such reinforced solder joints is also disclosed.

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