Removable electronic subassembly with a compressible shock...

H - Electricity – 05 – K

Patent

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Details

H05K 7/10 (2006.01) G06F 1/16 (2006.01) G11B 25/04 (2006.01) G11B 33/08 (2006.01) G11B 33/12 (2006.01) H05K 5/02 (2006.01)

Patent

CA 2208045

A removable electronic subassembly is designed for placement into a data processing system which requires said removable electronic subassembly to fit into an aperture defining a selected form factor. The removable electronic subassembly comprises a rigid enclosure which encloses interior components of the removable electronic subassembly. The rigid enclosure has exterior dimensions which are smaller than the selected form factor. A layer of resilient material is mounted to an exterior of the rigid enclosure. The layer of resilient material and the rigid enclosure have at least one exterior dimension which exceeds the selected form factor in an uncompressed state wherein the resilient material may be compressed such that the at least one exterior dimension conforms to the selected form factor.

L'invention concerne un sous-ensemble électronique amovible destiné à être monté dans un système informatique nécessitant que ce sous-ensemble tienne dans une ouverture définissant un encombrement choisi. Ledit sous-ensemble comporte une enceinte rigide entourant ses composants intérieurs. Cette enceinte rigide présente des dimensions extérieures inférieures à l'encombrement choisi. Une couche de matière élastique est placée sur une face extérieure de l'enceinte rigide. Cette couche élastique et l'enceinte rigide présentent au moins une dimension extérieure excédant, en l'absence de compression, l'encombrement choisi, la matière élastique pouvant être comprimée de manière qu'au moins une dimension extérieure soit conforme à l'encombrement choisi.

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