Removal of material by polarized radiation and back side...

B - Operations – Transporting – 23 – K

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B23K 26/00 (2006.01) B08B 7/00 (2006.01) G03F 7/20 (2006.01) G03F 7/42 (2006.01) H01L 21/268 (2006.01) H01L 21/3205 (2006.01) H01L 21/768 (2006.01)

Patent

CA 2222502

An apparatus and method for selectively removing undesired material from the surface of a substrate provides a flow of inert gas over the undesired material substrate surface while irradiating the undesired material with energetic photons. The invention enables removal of undesired material without altering the physical properties of the material underlying or adjacent the removed, undesired material. Removal effectiveness may be enhanced by utilizing polarized energetic photons. Directing a laser beam to the back side of a transparent substrate may enhance the effectiveness of removal.

Le procédé et l'appareil décrits permettent d'enlever sélectivement un matériau indésirable de la surface d'un substrat. Un flux de gaz inerte s'écoule sur la surface du substrat qui porte le matériau indésirable et le matériau indésirable est irradié avec des photons énergétiques. L'invention permet d'enlever le matériau indésirable sans affecter les propriétés physiques du matériau sous-jacent ou adjacent au matériau indésirable enlevé. On peut augmenter l'efficacité d'enlèvement en utilisant des photons énergétiques polarisés et en dirigeant un faisceau laser sur le côté postérieur d'un substrat transparent.

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