Removing adherent organic material from the surface of a...

C - Chemistry – Metallurgy – 11 – D

Patent

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C11D 3/08 (2006.01) C11D 1/88 (2006.01) C11D 3/00 (2006.01) C11D 3/10 (2006.01) C11D 3/20 (2006.01) C11D 3/30 (2006.01) C11D 3/34 (2006.01) C11D 3/43 (2006.01) C11D 11/00 (2006.01) C23G 1/14 (2006.01) C23G 1/22 (2006.01)

Patent

CA 2443308

A solution capable of removing adherent organic material from the surface of a solid substrate at room temperature is disclosed. The solution includes a first solvent, preferably water, having dissolved therein: up to 2% alkali metal silicates, a source of alkalinity that is substantially free of alkali metal hydroxide ions, at least one organic solvent, and an amount of hydrotrope effective to render the organic solvent or solvents soluble in the solution, an amino alcohol may be included, at least one surfactant, and a corrosion inhibitor may be included. The solution should have an alkaline pH less than about 12. The solution is used to remove the adherent organic material by soaking the object having such material thereon in such a solution, preferably at room temperature.

L'invention concerne une solution permettant d'éliminer un matériau organique adhésif de la surface d'un substrat solide à température ambiante. La solution comprend un premier solvant, de préférence de l'eau, dans lequel sont dissous : jusqu'à 2 % de silicates de métal alcali, une source d'alcalinité ne comprenant sensiblement pas d'ions d'hydroxyde de métal alcali, au moins un solvant organique, et une quantité d'hydrotrope efficace pour rendre le ou les solvants organiques solubles dans la solution. Un alcool amino et un inhibiteur de corrosion peuvent être inclus, ainsi qu'au moins un surfactant. La solution doit posséder un pH alcalin inférieur à environ 12. La solution est utilisée pour éliminer le matériau organique adhésif par trempage de l'objet comprenant ledit matériau dans la solution, de préférence à température ambiante.

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