Removing hardened organic materials during fabrication of...

Details Removing hardened organic materials during fabrication of... Removing hardened organic materials during fabrication of...

H - Electricity

01

L

356/192

H01L 21/70 (2006.01) G03F 7/42 (2006.01) H01L 21/311 (2006.01)

Patent

CA 1159577

REMOVING HARDENED ORGANIC MATERIALS DURING FABRICATION OF INTEGRATED CIRCUITS Abstract of the Disclosure In an integrated circuit fabrication sequence, a hardened mask layer adhered to an underlying substrate is removed from the substrate by a solvent that comprises anhydrous hydrazine and dimethyl sulfoxide. The solvent rapidly penetrates the interface between the pattern and the underlying substrate and quickly breaks the adhesive bonds therebetween. Other materials in the structure being fabricated are not deleteriously affected by the solvent.

390813

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