Resealable film structure

B - Operations – Transporting – 65 – D

Patent

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Details

B65D 65/26 (2006.01) B65D 17/28 (2006.01) A23L 3/00 (2006.01)

Patent

CA 2599062

A reclosable film structure for a package is disclosed, in particular a reclosable lap seal, comprising a multiple layer film with an interior pressure sensitive adhesive layer, and methods of manufacture thereof. The pressure sensitive adhesive layer is positioned between a first and a third layer on either side of the pressure sensitive adhesive layer and is continuous throughout the package. The package is heat sealed at an open end to initially close the package by folding over an outer lap seal segment onto an inner lap seal segment and heat-sealing together. Upon opening the package at the lap seal, the package delaminates between the first and second layers along one of the lap seal segments, thus exposing the pressure sensitive adhesive layer to facilitate reclosing the package, oriented away from the package interior and away from the food removal path to maintain the adhesion strength by avoiding food contact.

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