Resin composition

Details Resin composition Resin composition

C - Chemistry, Metallurgy

08

L

400/5703

C08L 67/00 (2006.01)

Patent

CA 1256622

SO-1-37923C/YT/85 ABSTRACT A resin composition is described, comprising from 60 to 97% by weight of a heat-fusible wholly aromatic copolyester represented by the general formula: Image (wherein d, e, and f are not equal to 0 and e/f is from 0.90 to 1.10, and n is 0 or 1) and from 3 to 40% by weight of a polyarylate. The wholly aromatic copolyester of the above general formula has high heat resistance and exhibits excellent fluidity at suitable processing temperatures, but it has properties that because of high injection molding temperature, its melt viscosity tends to vary greatly with even a slight change in molding temperature, Thus it can provide only molded articles which have a bad appearance and a low impact strength and are brittle. Blending with the polyarylate permits to successfully overcome all the above-described drawbacks without impairing the heat resistance.

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