Resin composition

Details Resin composition Resin composition

C - Chemistry, Metallurgy

08

L

C08L 39/04 (2006.01) C08K 5/3415 (2006.01) C08L 29/00 (2006.01) C08L 61/06 (2006.01) C08L 63/00 (2006.01) C08L 65/00 (2006.01) H01B 3/30 (2006.01) H01B 3/36 (2006.01) H01B 3/40 (2006.01) C08L 79/08 (2006.01)

Patent

CA 2048981

Abstract of the Disclosure A resin composition for sealing semiconductors which comprises an organic component (A) which contains (a) a polymaleimide compound represented by the formula (I): Image (I) wherein R1 is a m-valent organic group having two or more carbon atoms and m is an integer of two or more and (b) a phenolic aralkyl resin represented by the formula (II): Image (II) wherein X is a divalent group having the formula Image or Image , and n is an integer of from 0 to 100, or contains a mixture of the phenolic aralkyl resin and a phenol, and component (B) which contains an inorganic filler.

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