Resin composition

C - Chemistry – Metallurgy – 08 – F

Patent

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400/1811, 117/20

C08F 212/08 (2006.01) C08F 212/06 (2006.01) C08F 214/04 (2006.01) C08F 220/00 (2006.01) C08F 220/14 (2006.01) C08F 220/44 (2006.01) C08L 25/02 (2006.01)

Patent

CA 1056993

Abstract of the Disclosure A water reducible resin composition, a water reducible admixture of such resin with solvents and plasticizers, a water reduced form of such mixture suitable for a coating, and a coating prepared from such water reduced mixture. Said resin is required to be prepared from a balance of hydrophobic enhancing and hydrophilic enhancing monomers. Generally such hydrophobic enhancing monomers are required to be a balance of monomers promoting hard and soft segments of the resin.

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