C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 23/08 (2006.01) B32B 7/12 (2006.01) B32B 27/32 (2006.01) B32B 27/34 (2006.01) C08K 5/09 (2006.01) C08K 5/098 (2006.01) C08L 23/02 (2006.01) C08L 23/06 (2006.01) C08L 53/00 (2006.01) C08L 77/00 (2006.01) C09J 123/08 (2006.01) C09J 177/00 (2006.01)
Patent
CA 2098990
ABSTRACT A resin composition comprising (A) an ethylenic multi-component copolymer (an ethylene-maleic anhydride-methyl methacrylate ternary copolymer or the like) and at least one component selected from the group consisting of (B) a polyolefinic resin (a low density polyethylene or the like), (C) a metal salt of an organic carboxylic acid (an ionomer or the like) and (D) a copolymerized nylon (a nylon 6/66/12 copolymer or the like) and a multi-layer laminate having the resin composition described above as the adhesive layer are disclosed. This resin composition is a hot melt- type adhesive resin composition and has an excellent adhesive property to a wide range of base materials. Particularly, the resin composition comprising (B) or (C) is favorable for production of multi-layer laminates used for interior materials of automobiles and the like. The resin composition comprising (D) has an excellent adhesive property to the base materials to which sufficient adhesive property could not be obtained before. 58
Ikenaga Yoshinori
Inazawa Shintaro
Nagaoka Takashi
Tagoshi Hirotaka
Terasawa Takeo
Showa Denko K.k.
Smart & Biggar
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