C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/6492
C08L 9/06 (2006.01) C08L 35/00 (2006.01) C08L 35/06 (2006.01) H05K 5/02 (2006.01) C08L 25/08 (2006.01)
Patent
CA 2010999
- 22 - ABSTRACT OF THE DISCLOSURE A glass fiber-reinforced synthetic resin composition is proposed which is particularly suitable as a molding material of chassis of electric and electronic instruments to satisfy the various requirements in this particular application. The resin composition comprises: (A) 100 parts by weight of a copolymeric resin of styrene and maleic anhydride or a derivative thereof, of which the molar fraction of the moiety of maleic anhydride or a derivative thereof is in the range from 3 to 20%; (B) from 1 to 30 parts by weight of a styrene-based thermoplastic elastomer, of which the weight fraction of the moiety of styrene is in the range from 5 to 50%; (C) from 5 to 80 parts by weight of glass fibers, (D) from 5 to 30 parts by weight of a bromine-containing organic compound as a flame retardant; and (E) from 2 to 15 parts by weight of antimony trioxide.
Hosomi Hidezo
Mihara Masami
Miura Yoshiaki
Idemitsu Petrochemical Company Limited
Kirby Eades Gale Baker
LandOfFree
Resin composition and chassis for electronic instruments... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Resin composition and chassis for electronic instruments..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin composition and chassis for electronic instruments... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1687131