C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 29/02 (2006.01) C08J 3/205 (2006.01) C08J 5/00 (2006.01) C08K 3/00 (2006.01) C08K 3/24 (2006.01) C08K 3/38 (2006.01) C08L 23/08 (2006.01) C08L 29/04 (2006.01) C08L 77/00 (2006.01)
Patent
CA 2475554
The present invention provides a resin composition which comprises EVOH and a thermoplastic resin other than EVOH and which generates less odor and therefore is suitable for food packaging applications. The invention also provides an environmentally friendly method for producing a resin composition, without releasing any carboxylic acid such as acetic acid to the peripheral environment. A resin composition containing less carboxylate group is obtained by contacting an ethylene-vinyl alcohol copolymer resin with an aqueous solution containing both carbon dioxide gas and at least one additive selected from the group consisting of an alkali metal salt (A) and a boron compound (B) and then melt kneading with a thermoplastic resin (G) other than EVOH.
Hara Tetsuya
Ikeda Kaoru
Kawamura Syukiti
Kida Noriyuki
Uchiumi Naohiko
Kirby Eades Gale Baker
Kuraray Co. Ltd.
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