B - Operations – Transporting – 29 – C
Patent
B - Operations, Transporting
29
C
18/1043, 400/581
B29C 55/00 (2006.01) C08L 27/08 (2006.01)
Patent
CA 1338847
Disclosed herein are a resin composition comprising 5 to 95 % by weight of a vinylidene chloride resin and 5 to 95 % by weight of a polyamide resin having a low crystalline melting point of not higher than 210°C and a molded product of said resin composition. The molded product of the present invention shows a molded product excellent in gas-barrier property and impact strength at low temperature, particularly a film, sheet or container. Among the resin compositions of the present invention, since the composition having 60 to 95 % by weight of vinylidene chloride resin is particularly rich in gas-barrier property, it is suitable for packaging foods, and since the composition having more than 40 % by weight and not more than 95 % by weight of polyamide resin is excellent particularly in impact strength at low temperature, it is suitable as the packaging material for use at an extremely low temperature. Moreover, the gas-barrier property and the transparency of the latter molded product which is rich in polyamide resin can be improved by stretching the product so that the dispersed particle of vinylidene chloride resin is made to be flat.
596148
Hirose Kazuhiko
Hisazumi Nobuyuki
Ohba Hiroyuki
Uehara Tsutomu
Goudreau Gage Dubuc
Hirose Kazuhiko
Hisazumi Nobuyuki
Kareha Kagaku Kogyo Kabushiki Kaisha
Ohba Hiroyuki
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