Resin composition, and prepreg

C - Chemistry – Metallurgy – 08 – G

Patent

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Details

C08G 59/50 (2006.01) C08J 5/24 (2006.01) C08L 63/00 (2006.01) C08L 101/00 (2006.01)

Patent

CA 2683073

Disclosed is a resin composition comprising, as essential components, 100 parts by mass of an epoxy resin [A], 41 to 80 parts by mass of a thermoplastic resin particle [B], and 20 to 50 parts by mass (in terms of diaminodiphenylsulfone) of microencapsulated diaminodiphenylsulfone [C] which is microcapsulated with a coating agent, wherein the thermoplastic resin particle [B] comprises at least a thermoplastic resin particle [B1] having an average particle diameter of 1 to 50 µm and a thermoplastic resin particle [B2] having an average particle diameter of 2 to 100 µm at a ratio of 3:1 to 1:3 by mass, and wherein theratio of the average particle diameter (D2) of the thermoplastic resin particle [B2] to the average particle diameter (D1) of the thermoplastic resin particle [B1] (i.e., a D2/D1 ratio) is 2 or more. Also disclosed is a prepreg produced by using the composition.

L'invention concerne une composition de résine comprenant, en tant que composants essentiels, 100 parties en masse d'une résine époxyde [A], 41 à 80 parties en masse de particules de résine thermoplastique [B] et 20 à 50 parties en masse (en termes de diaminodiphénylsulfone) de diaminodiphénylsulfone microencapsulée [C] qui est microencapsulée dans un agent d'enrobage, lesdites particules de résine thermoplastique [B] comprenant au moins des particules de résine thermoplastique [B1] ayant un diamètre moyen des particules de 1 à 50 µm et des particules de résine thermoplastique [B2] ayant un diamètre moyen des particules de 2 à 100 µm en proportion de 3:1 à 1:3 en masse et le rapport du diamètre moyen (D2) des particules de résine thermoplastique [B2] sur le diamètre moyen (D1) des particules de résine thermoplastique [B1] (c'est-à-dire le rapport D2/D1) étant supérieur ou égal à 2. L'invention concerne également un préimprégné produit en utilisant la composition.

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