Resin composition, coating material comprising said resin...

C - Chemistry – Metallurgy – 08 – L

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400/5124, 400/65

C08L 25/16 (2006.01) C09D 5/44 (2006.01) C09D 125/18 (2006.01) C25D 13/06 (2006.01)

Patent

CA 1176781

ABSTRACT OF THE DISCLOSURE A resin composition comprising (A) a polymer having, in the molecule, at least two groups represented by the following structural formula (I): (I) Image wherein R1 is isopropyl, sec-butyl, tert-butyl, a C5-20 alkyl group, a C3-20 cycloalkyl group, a C5-20 alkenyl group, a C3-20 hydroxyalkyl group, a C5-20 alkoxyalkyl group, a C3-20 aminoalkyl group, a C6-20 aryl group or a C6-20 arylalkyl group, and n is 0, 1 or 2, and (B) a polymer having an electron attractive group and an .alpha.,.beta.-ethylenic double bond sdjacent thereto. Though said composition is stable at room temperature, it is crosslinked and cured at high temperatures because the amino group of the polymer (A) adds to the double bond of the polymer (B). Accordingly, said resin composition is suitable for use as a cathodic electrocoating material.

390115

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