Resin composition comprising water-soluble polyamide and...

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

96/172, 400/5158

C08L 77/00 (2006.01) C08L 29/04 (2006.01) C09J 129/04 (2006.01)

Patent

CA 1149985

ABSTRACT OF THE DISCLOSURE A resin composition is described consisting essentially of from 0.5 to 100 parts by weight of a water- soluble polyamide and from 0.5 to 100 parts by weight of a vinyl alcohol-based polymer. The resin composition has excellent transparency and can be used, for example, to form light-sensitive rosin compositions and adhesives.

376085

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