C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
96/172, 400/5158
C08L 77/00 (2006.01) C08L 29/04 (2006.01) C09J 129/04 (2006.01)
Patent
CA 1149985
ABSTRACT OF THE DISCLOSURE A resin composition is described consisting essentially of from 0.5 to 100 parts by weight of a water- soluble polyamide and from 0.5 to 100 parts by weight of a vinyl alcohol-based polymer. The resin composition has excellent transparency and can be used, for example, to form light-sensitive rosin compositions and adhesives.
376085
Doi Osamu
Okamoto Takashi
Riches Mckenzie & Herbert Llp
Unitika Ltd.
LandOfFree
Resin composition comprising water-soluble polyamide and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Resin composition comprising water-soluble polyamide and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin composition comprising water-soluble polyamide and... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-126708