C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/6306
C08L 25/04 (2006.01) C08L 71/12 (2006.01)
Patent
CA 1056091
ABSTRACT OF THE DISCLOSURE A resin composition comprising 5 to 95 parts by weight of a copolyphenylene ether derived from a mixture of 50 to 98 mole% of a 2,6-dialkylphenol and 2 to 50 mole% of a 2,3,6-trialkylphenol and 5 to 95 parts by weight of a styrene resin. The composition has superior thermal resistance and oxidation stability under heat and satisfactory mechanical properties, and retains these desirable properties after heat-aging. The composition is suitable for preparation of molded articles. - 1 -
237903
Kawaki Takao
Masu Masanobu
Sasaki Yukio
Sugio Akitoshi
Yonemitsu Eiichi
Mitsubishi Gas Chemical Company
Na
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