Resin composition curable at low temperature

Details Resin composition curable at low temperature Resin composition curable at low temperature

C - Chemistry, Metallurgy

08

G

402/33

C08G 16/00 (2006.01) C08G 59/42 (2006.01) C08G 59/44 (2006.01) C08G 59/48 (2006.01) C08G 59/58 (2006.01) C08L 63/00 (2006.01)

Patent

CA 2012064

- 24 - ABSTRACT Disclosed is a resin composition curable at low temperature comprising, (A) epoxy resins having an epoxy equivalence of 100 to 4,000; (B) .alpha.-ketoecter compounds expressed by the following formula; Image (wherein R is an organic group having a molecular weight of 1 to 100,000, X is a carbon, oxygen- or sulfur atom and -NR2-, R1 and R2 are independently an alkyl-, alkenyl-, alkynyl-, aryl-, alalkyl-, alkaryl-, cychloalkyl- and heterocyclic group, and n is an integer of 1 or more,] and (C)polyamine compound or polyamide compound having a primary and/or secondary amino group; a solid weight ratio of the component (A) and (B) meeting the following relation (A)/(B)-99/1 to 5/95 and an epoxy equivalent of the component (A), and .alpha. -ketoester equivalent of the component (B) and an active hydrogen equivalent of the component (C) meeting the following relation; (A)+(B)/(C)= 100/10 to 100/200.

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