C - Chemistry – Metallurgy – 09 – D
Patent
C - Chemistry, Metallurgy
09
D
C09D 5/46 (2006.01) C23C 18/16 (2006.01) C23C 18/20 (2006.01) C23C 18/31 (2006.01) H05K 1/03 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01)
Patent
CA 2171516
Disclosed is a resin composition for electroless metal deposition, which consists essentially of a polymer (A) having at least one chemical structure selected from the below-listed group (a); and at least one compound selected from the below-listed compounds (b)1 and (b)2: (a) a chemical structure, in which a part of hydrogen in the main chain of polymer is substituted with the halogen group or the nitrile group, and a chemical structure having a double bond at a portion held between the aromatic substituents in the main chain of the polymer; and (b)1 a polymer (B) having a functional group which is capable of forming a metal salt; and (b)2 a low molecular weight compound (C) containing a functional group which is capable of forming a metal salt, and having complete miscibility with the polymer (A) to form one phase. Also disclosed is a method for electroless metal deposition, which comprises steps of: forming, on the surface of a non-conductive body to be plated, a coating of a resin composition for the electroless metal deposition containing therein a polymer (A) having a chemical structure of at least one compound selected from the group consisting of the below- listed (a), and at least one compound selected from the group of the below-listed (b)1 and (b)2; applying a negative electrostatic voltage to the film coating of the resin composition at a temperature level above the glass transition point of said resin composition; thereafter removing the applied voltage at a temperature lower than the glass transition temperature; and successively carrying out the metal deposition steps inclusive of the catalyst imparting step and the activating step: (a) a chemical structure, in which a part of hydrogen in the main chain of polymer is substituted with the halogen group or the nitrile group, and a chemical structure having a double bond at a portion held between the aromatic substituents in the main chain of the polymer; and (b)1 a polymer (B) having a functional group which is capable of forming a metal salt; and (b)2 a low molecular weight compound (C) having a functional group which is capable of forming a metal salt, and having complete miscibility with the polymer (A) to form one phase.
Kita Toshiyuki
Sato Kazuya
Takagi Kaneyuki
Robic
Sankei Giken Kogyo Kabushiki Kaisya
LandOfFree
Resin composition for electroless metal deposition and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Resin composition for electroless metal deposition and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin composition for electroless metal deposition and... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1743836