Resin composition for printed circuit board

Details Resin composition for printed circuit board Resin composition for printed circuit board

C - Chemistry, Metallurgy

08

L

400/5046, 400/76

C08L 67/03 (2006.01) C08K 3/26 (2006.01) C08K 7/04 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1312160

ABSTRACT OF THE DISCLOSURE A resin composition for printed circuit board comprising: (A) 30 - 90% by weight of a liquid crystal polyester, (B) 3 - 50% by weight of an inorganic fibrous or acicular material having an average diameter of 15 µm or below and an average length of 200 µm or below, and (C) 3 - 30% by weight of an alkaline earth metal carbonate.

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