C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4218, 400/54
C08L 61/14 (2006.01) C08G 59/40 (2006.01) C08G 59/62 (2006.01) C08L 63/00 (2006.01) C08L 79/08 (2006.01) H01B 3/40 (2006.01) H05K 3/00 (2006.01)
Patent
CA 2016626
Abstract of the Disclosure A resin composition for sealing semiconductors which exhibits high heat resistance and is suitable for sealing semiconductor devices, etc., and which comprises an organic component containing a polymaleimide compound represented by the general formula : Image where R1 is a m-valent organic group having at least 2 carbon atoms and m is a positive integer of 2 or more, and phenols mainly consisting of a phenol compound represented by the general formula : Image where n is a positive integer of 3 - 16, or an organic component containing (c) epoxy resin in addition to the polymaleimide and the phenol compound, and an inorganic filler.
Asahina Koutarou
Kitahara Mikio
Kubo Takayuki
Machida Koichi
Torikai Motoyuki
Asahina Koutarou
Fetherstonhaugh & Co.
Kitahara Mikio
Kubo Takayuki
Machida Koichi
LandOfFree
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