C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4218, 400/46
C08L 61/14 (2006.01) C08G 59/32 (2006.01) C08G 59/40 (2006.01) C08G 59/62 (2006.01) C08L 63/00 (2006.01) C08L 79/08 (2006.01) H01L 23/29 (2006.01) H05K 3/00 (2006.01)
Patent
CA 2016645
Abstract of the Disclosure A resin composition for sealing semiconductors which shows high heat resistance and is suitable for sealing semiconductor devices, etc., and which comprises an organic component containing a polymaleimide compound represented by the general formula : Image where R1 is a m-valent organic group having at least 2 carbon atoms and m is a positive integer of 2 or more, epoxy compounds mainly consisting of an epoxy compound represented by the general formula : Image where n is a positive integer of 3 - 16 and a compound having two or more phenolic hydroxyl groups, and an inorganic filler.
Asahina Koutarou
Kitahara Mikio
Kubo Takayuki
Machida Koichi
Torikai Motoyuki
Asahina Koutarou
Fetherstonhaugh & Co.
Kitahara Mikio
Kubo Takayuki
Machida Koichi
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