Resin composition, prepreg, laminate, and wiring board

Details Resin composition, prepreg, laminate, and wiring board Resin composition, prepreg, laminate, and wiring board

C - Chemistry, Metallurgy

08

G

C08G 59/26 (2006.01) C08J 5/24 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2649841

A resin composition which is inexpensive and lowly heat-expandable; a prepreg; a laminate; and a wiring board. The resin composition is for use in producing laminates and contains an insulating resin having aromatic rings. In the insulating resin in the stage of a laminate, the molecular weight of segments between the crosslinked sites, as determined from shear moduli at temperatures not lower than the Tg of the insulating resin having aromatic rings, is 300-1,000.

La présente invention concerne une composition de résine peu coûteuse et faiblement thermoexpansible, un préimprégné, un stratifié et une carte de câblage. La composition de résine destinée à intervenir dans la production de stratifiés comprend une résine isolante renfermant des noyaux aromatiques. Dans la résine isolante, au stade d'un stratifié, le poids moléculaire de segments entre les zones réticulées, tel que déterminé à partir de modules de cisaillement à des températures supérieures ou égales au Tg de la résine isolante renfermant des noyaux aromatiques, est de 300 à 1000.

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