C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4701, 400/53
C08L 101/06 (2006.01) C07F 7/08 (2006.01) C07F 7/18 (2006.01) C08G 59/02 (2006.01) C08G 59/04 (2006.01) C08G 59/30 (2006.01) C08G 59/32 (2006.01) C08G 59/70 (2006.01) C08K 5/00 (2006.01) C08K 5/07 (2006.01) C08K 5/1515 (2006.01) C08K 5/5415 (2006.01) C08L 63/00 (2006.01) C08L 75/04 (2006.01) C09D 133/06 (2006.01) C09D 143/04 (2006.01) C09D 163/00 (2006.01) C08L 33/06 (2006.01) C08L 43/04 (2006.01)
Patent
CA 1339996
The invention provides the following resin compositions. 1. A composition comprising (A), (B), (C) and (D); 2. a composition comprising (A), (E) and (D); 3. a composition comprising (F), (G) and (D); and 4. a composition comprising (H), (C) and (D). where (A) a high molecular weigh, hydroxy compound containing an average of 2 or more hydroxyl groups per molecule and having a number average molecular weight of 3,000 to 200,000; (B) an epoxy compound containing an average of 2 or more epoxy groups per molecule and having a number average molecular weight of 120 to 200,000, (C) a silane compound containing an average of 1 or more alkoxysilane, silanol and/or acyloxysilane groups per molecule and having a number average molecular weight of 104 to 200,000, (D) at least one chelate compound of aluminum, titanium or zirconium, (E) a high molecular weight compound containing an average of 2 or more epoxy groups and an average of 1 or more alkoxysilane, silanol and/or acyloxysilane groups per molecule and having a number average molecular weight of 3,000 to 200,000, (F) a high molecular weight compound containing an average of 2 or more hydroxyl groups and an average of 1 or more alkoxysilane, silanol and/or acyloxysilane groups per molecule and having a number average molecular weight of 3,000 to 200,000; (G) a low molecular weight compound containing an average of 2 or more epoxy groups per molecule and having a number average molecular weight of 240 to 5,000; and (H) a high molecular weight compound containing an average of 2 or more hydroxyl groups and an average of 2 or more epoxy groups per molecule and having a number average molecular weight of 3,000 to 200,000. A method of curing these compositions at a temperature not exceeding 100°C is also described.
610477
Isozaki Osamu
Iwasawa Naozumi
Nakai Noboru
Kansai Paint Company Limited
Ridout & Maybee Llp
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