C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 23/04 (2006.01) B32B 1/08 (2006.01) C08L 23/10 (2006.01) C08L 23/16 (2006.01) G02B 1/10 (2006.01)
Patent
CA 2105264
A resin composition comprises 100 parts by weight of an ethylene-base resin comprising at least 2 wt.% of linear low-density polyethylene and 0.1-30 parts by weight of an organopolysiloxane having an average molecular weight of at least 100,000. The resin com- position can be produced by melting and kneading the organopolysiloxane together with the linear low-density polyethylene and then melting and kneading the result- ing polymer blend together with the ethylene-base resin other than the linear low-density polyethylene. The resin composition may additionally comprise 0.1-100 parts by weight of a propylene-base resin. In the lat- ter resin composition, the organopolysiloxane is con- tained in an amount of 0.1-30 parts by weight per 100 parts by weight of the sum of the ethylene-base resin and the propylene-base resin. The latter resin com- position can be produced by melting and kneading the organopolysiloxane together with the propylene-base resin and then melting and kneading the resulting polymer blend together with the ethylene-base resin. Optical fiber feeding pipes and optical fiber units making use of such resin compositions are also de- scribed.
Miyamoto Matsuhiro
Mogi Akio
Nakakura Yasushi
Sano Akira
Suzuki Kazunari
Idemitsu Petrochemical Co. Ltd.
Kirby Eades Gale Baker
Ltd. Fujikura
Miyamoto Matsuhiro
Mogi Akio
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