B - Operations – Transporting – 32 – B
Patent
B - Operations, Transporting
32
B
B32B 15/08 (2006.01) C09J 7/00 (2006.01) C09J 7/02 (2006.01) H05K 3/02 (2006.01)
Patent
CA 2338670
A laminate (120) for use in production of printed circuit boards comprising a metal foil (22) having a first side and a second side; a metallic substrate (24), one side of the metallic substrate being attached to the first side of the metal foil; an adhesive substrate (122, 124) formed of a polymeric material having a first surface and a second surface, the first surface being attached to the second side of the metal foil the adhesive substrate being at least partially uncured; and a releasable protective film (126) along the second surface of the adhesive substrate.
L'invention concerne un matériau qui comprend une feuille de métal (22) pourvue d'un premier côté et d'un second côté; un substrat métallique (24) dont l'un des côtés est fixé sur le premier côté de la feuille de métal; un substrat adhésif (122, 124) constitué d'une matière polymère et pourvu d'une première surface et d'une seconde surface, la première surface étant fixée sur le second côté de la feuille de métal et le substrat adhésif étant au moins partiellement non durci; enfin, un film de protection détachable (126) disposé le long de la seconde surface du substrat adhésif.
Chiang Shiuh-Kao
Steiner R. Richard
Ga-Tek Inc. (dba Gould Electronics Inc.)
Nikko Materials Usa Inc.
Norton Rose Or S.e.n.c.r.l. S.r.l./llp
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