Resin for composite structures

Details Resin for composite structures Resin for composite structures

C - Chemistry, Metallurgy

08

G

C08G 18/32 (2006.01) C08G 18/48 (2006.01)

Patent

CA 2629139

A resin precursor composition for use in the production of composite components includes an isocyanate component comprising a material selected from the group consisting of diphenylmethane diisocyanate, a polymeric isomer of diphenylmethane diisocyanate, and combinations thereof. The resin precursor composition also includes at least one polyether polyol having a functionality of three in an amount such that the ratio of the isocyanate component to the at least one polyol is between approximately 80% and 115% of stoichiometric. The resin precursor composition also includes a mold release material and a filler material.

Cette invention concerne un précurseur de résine utilisé pour la fabrication d'éléments composites. Ce précurseur comprend une composante isocyanate contenant un matériau pris dans le groupe comprenant un diphénylmethane diisocyanate, un isomère polymère de diphénylméthane diisocyanate, et une combinaison des deux. Cette composition précurseur de résine comprend également au moins un polyéther polyol à fonctionnalité de trois en quantité telle que le rapport stoïchométrique entre le composant isocyanate et le polyol est compris entre 80 et 115 % environ. La composition précurseur de résine comprend également un matériau de démoulage et un matériau de charge.

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